‘FeRAM-embedded ASSP Drives Innovation in 1 mm² Smart Contact Lenses’ published on November 5^th features RAMXEED’s Development Team in an exclusive interview.

Overview

EE Times (Electronic Engineering Times) is a well-established global media outlet that covers news, analysis, and insights related to the electronics and semiconductor industries. It serves engineers, technologists, and business leaders by reporting on emerging technologies, product innovations, market trends, and industry developments.

The article focuses on an interview with SEED and RAMXEED based on the technology and development of a highly compact FeRAM-embedded ASSP chipset, measuring just 1.04 mm², made for SEED’s smart contact lens platform, integrating RF communication, power generation, SPI, and AD conversion to support multifunctional sensing in ultra-small wearables. It is explained how the use of FeRAM enables low-power, high-speed data handling even in unstable wireless environments, while the chip’s ability to output three distinct voltages (1.8V, 2.2V, 3V) ensures compatibility with various sensors. This collaboration with SEED reflects RAMXEED’s strength in analog and RF design, rapid development cycles, and deep foundry integration, positioning the company to expand into medical and IoT markets through scalable, general-purpose platforms for smart lenses and beyond.

Interview (EE Times)

Leveraging RF x AD conversion analog technology

“RAMXEED developed an ultra-small FeRAM chipset measuring just 1.04 mm². Since this product was designed for SEED’s smart contact lenses platform, RAMXEED had to meet the rigorous 1 mm² size requirement by leveraging its advanced design capabilities of combining FeRAM and analog semiconductor technology. What technological innovations made this possible? We discussed it with Shinya Ito, Director of the Product Design & Application Engineering Department at RAMXEED, and Taku Kinoshita, General Manager of the Device Development Department at SEED. […]”

Related Links

• About FeRAM-embedded ASIC/ASSP
• EE Times EU – FeRAM-embedded ASSP in Smart Contact Lenses
• Original article (Japanese – available until September 2027)

About RAMXEED

RAMXEED (former Fujitsu Semiconductor Memory Solution), specializes in innovative memory solutions, including FeRAM and ReRAM technologies. With over 25 years of accumulated sales of 4.6 billion FeRAM units and a focus on high-performance, energy-efficient non-volatile memory products, we aim to continue driving memory innovation for a variety of industries and applications.